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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10674610 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Feb. 19, 2020

Multilayer rigid flexible printed circuit board and method for manufacturing the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Yang Je Lee, Suwon-si, KR;

Dek Gin Yang, Suwon-si, KR;

Dong Gi An, Suwon-si, KR;

Jae Ho Shin, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/06 (2013.01); H05K 1/028 (2013.01); H05K 1/0218 (2013.01); H05K 1/0278 (2013.01); H05K 1/09 (2013.01); H05K 3/386 (2013.01); H05K 3/4644 (2013.01); H05K 3/4691 (2013.01); H05K 3/0035 (2013.01); H05K 3/281 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0707 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/1152 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49165 (2015.01);
Abstract

The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Find Patent Forward Citations

Lee, Yang. (2020). Multilayer rigid flexible printed circuit board and method for manufacturing the same (U.S. Patent No. 10674610). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10674610

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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