The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Jan. 05, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Yang Je Lee, Suwon-si, KR;
Dek Gin Yang, Suwon-si, KR;
Dong Gi An, Suwon-si, KR;
Jae Ho Shin, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/06 (2013.01); H05K 1/028 (2013.01); H05K 1/0218 (2013.01); H05K 1/0278 (2013.01); H05K 1/09 (2013.01); H05K 3/386 (2013.01); H05K 3/4644 (2013.01); H05K 3/4691 (2013.01); H05K 3/0035 (2013.01); H05K 3/281 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0707 (2013.01); H05K 2203/0554 (2013.01); H05K 2203/1152 (2013.01); Y10T 29/49128 (2015.01); Y10T 29/49165 (2015.01);
Abstract
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.