Company Filing History:
Years Active: 2020-2025
Title: Yang-Chun Cheng: Innovator in Semiconductor Technology
Introduction
Yang-Chun Cheng is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
One of his latest patents is titled "Metal heterojunction structure with capping metal layer." This patent describes techniques for protecting a metal interconnect structure from damage during chemical mechanical polishing processes. The innovation involves receding the metal interconnect structure to create a recess, where a metal cap structure is formed. This design helps to reduce or eliminate gaps at the interface between the metal cap structure and the dielectric layer, enhancing the overall integrity of the device.
Another notable patent is the "External heating system for use in chemical mechanical polishing system." This invention includes a polishing pad designed to polish a substrate, along with a heating system that adjusts the temperature of the polishing pad. The system features at least one heating element spaced apart from the pad and a sensor to measure the pad's temperature, ensuring optimal polishing conditions.
Career Highlights
Yang-Chun Cheng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at TSMC has positioned him as a key player in advancing semiconductor manufacturing technologies.
Collaborations
Throughout his career, Cheng has collaborated with notable colleagues, including Chi-Jen Liu and Chi-Hsiang Shen. These partnerships have fostered innovation and contributed to the development of cutting-edge semiconductor solutions.
Conclusion
Yang-Chun Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor manufacturing and technology.