The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Sep. 17, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yi-Sheng Lin, Taichung, TW;
Chi-Hsiang Shen, Tainan, TW;
Chi-Jen Liu, Taipei, TW;
Chun-Wei Hsu, Hsinchu, TW;
Yang-Chun Cheng, Hsinchu, TW;
Kei-Wei Chen, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 37/20 (2012.01); B24B 53/017 (2012.01); B24B 57/02 (2006.01); B24B 49/14 (2006.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/20 (2013.01); B24B 49/14 (2013.01); B24B 53/017 (2013.01); B24B 57/02 (2013.01);
Abstract
A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.