Boise, ID, United States of America

Xiaopeng Qu

USPTO Granted Patents = 25 

Average Co-Inventor Count = 1.8

ph-index = 1

Forward Citations = 10(Granted Patents)


Location History:

  • Bellevue, WA (US) (2022)
  • Boise, ID (US) (2020 - 2024)
  • Redmond, WA (US) (2022 - 2024)

Company Filing History:


Years Active: 2020-2025

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25 patents (USPTO):Explore Patents

Title: Innovations in Semiconductor Technology by Xiaopeng Qu

Introduction

Xiaopeng Qu, located in Boise, ID, has made significant contributions to the field of semiconductor technology, holding an impressive portfolio of 25 patents. His work focuses on enhancing the thermal performance of semiconductor devices, which is crucial for the efficiency and reliability of modern electronic systems.

Latest Patents

Xiaopeng's recent patents showcase his expertise and innovation in the semiconductor domain. One of his notable patents is titled "Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same." This invention provides semiconductor device assemblies with a package substrate that incorporates one or more layers of thermally conductive material. These materials are designed to efficiently conduct heat generated by the semiconductor dies, preventing overheating. Various allotropes of carbon, including diamond, graphene, graphite, and carbon nanotubes, are utilized in the thermal layers, which can be applied through processes such as sputtering, PVD, CVD, or ALD.

Another significant patent by Qu is "Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture." This invention involves a microelectronic device package that securely houses one or more semiconductor dice coupled to a substrate. The design features a lid that creates a protective volume around the semiconductor die, filled with a thermally conductive dielectric filler material, enhancing the thermal management of the device.

Career Highlights

Xiaopeng Qu's career is marked by his dedication to innovation within Micron Technology Incorporated, where he continues to develop advanced semiconductor solutions. His efforts have not only contributed to the company's success but have also pushed the boundaries of semiconductor technology.

Collaborations

Throughout his career, Xiaopeng has collaborated with notable colleagues such as Hyunsuk Chun and Shams U Arifeen. These partnerships have fostered a creative environment, leading to groundbreaking inventions and improvements in semiconductor device design and manufacturing processes.

Conclusion

Xiaopeng Qu exemplifies the spirit of innovation in the semiconductor industry. His extensive patent portfolio, especially in thermal performance improvements, highlights his commitment to advancing technology. As he continues to work at Micron Technology, his contributions will undoubtedly influence the future of electronic devices, ensuring greater efficiency and performance for consumers worldwide.

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