The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Mar. 15, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Xiaopeng Qu, Redmond, WA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 1/18 (2006.01); F28F 3/02 (2006.01); H05K 1/02 (2006.01); G06F 1/20 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); F28F 3/02 (2013.01); G06F 1/20 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 7/1427 (2013.01); H05K 7/20127 (2013.01); H05K 7/20136 (2013.01); H05K 7/20436 (2013.01); H05K 3/366 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10522 (2013.01);
Abstract
Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprise at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy include transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.