The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Jun. 08, 2020
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Xiaopeng Qu, Bellevue, WA (US);
Hyunsuk Chun, Boise, ID (US);
Brandon P. Wirz, Boise, ID (US);
Andrew M. Bayless, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/447 (2006.01); H01L 21/67 (2006.01); H01L 21/033 (2006.01); B23K 20/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/447 (2013.01); H01L 21/0337 (2013.01); H01L 21/67092 (2013.01); B23K 20/025 (2013.01); B23K 20/026 (2013.01);
Abstract
This patent application relates to methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices with heat applied from a bond head of a thermocompression bonding tool. The stack is substantially enclosed within a skirt carried by the bond head to reduce heat loss and contaminants from the stack, and heat may be added from the skirt.