The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Jul. 28, 2020
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Xiaopeng Qu, Boise, ID (US);
Hyunsuk Chun, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01R 12/72 (2011.01); H01L 23/467 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20145 (2013.01); H01L 23/473 (2013.01); H01R 12/724 (2013.01); H01L 23/467 (2013.01); H05K 1/0203 (2013.01); H05K 7/205 (2013.01); H05K 7/20163 (2013.01);
Abstract
A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.