This inventor holds 4 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignee: Changxin Memory Technologies, Inc.. Active years: 2025-2026.
Company Filing History:
Years Active: 2025-2026
Title: Innovations by Xiaofei Sun
Introduction
Xiaofei Sun is a notable inventor based in Hefei, China. He has made significant contributions to the field of semiconductor technology. His work focuses on innovative packaging structures that enhance the performance and reliability of semiconductor devices.
Latest Patents
Xiaofei Sun holds 1 patent for a semiconductor package structure and manufacturing method. This patent describes a semiconductor package structure that includes a first package structure with an intermediary layer and a molding compound. The design features a plurality of first connection pads on the intermediary layer, with the molding compound wrapping the intermediary layer and being coplanar to the first connection pads. Additionally, a second package structure is disposed on the intermediary layer and is electrically connected to the first connection pads, creating a gap between the two package structures.
Career Highlights
Xiaofei Sun is currently employed at Changxin Memory Technologies, Inc., where he continues to develop innovative solutions in semiconductor packaging. His expertise in this area has contributed to advancements in memory technology and device performance.
Collaborations
Xiaofei Sun collaborates with Changhao Quan, a fellow innovator in the field. Their combined efforts aim to push the boundaries of semiconductor technology and improve manufacturing processes.
Conclusion
Xiaofei Sun's contributions to semiconductor packaging represent a significant advancement in the industry. His innovative designs and methods are paving the way for future developments in technology.