This inventor holds 26 USPTO granted patents and 3 published patent applications, primarily in Chip Packaging. Top assignee: Silergy Semiconductor Technology (Hangzhou) Ltd. Active years: 2014-2025.
Location History:
- Hangzhou, CH (2015)
- ZheJiang Province, CN (2016)
- Zhejiang, CN (2016)
- Hangzhou, CN (2014 - 2022)
Company Filing History:
Years Active: 2014-2025
Areas of Expertise:
Title: Innovator Spotlight: Xiaochun Tan and His Contributions to Semiconductor Packaging
Introduction: Xiaochun Tan is a prominent inventor from Hangzhou, China, recognized for his substantial contributions to the field of semiconductor technology. With a remarkable portfolio of 25 patents, he has played a pivotal role in developing innovative packaging solutions that enhance the efficiency and functionality of electronic devices.
Latest Patents: Among his latest contributions, Xiaochun Tan has designed a unique stacked package structure for chips. This patent outlines a sophisticated stacked package structure that integrates a substrate featuring two surfaces, a first die with defined active and back faces, and a first enclosure serving as a protective cover. The innovation includes an interlinkage that connects to the first enclosure for effective electrical coupling, a first redistribution body that partially exposes outer pins for external circuitry connection, and a penetrating body extending through the first enclosure and substrate. Furthermore, his design incorporates a second die with electrodes that are electrically linked to the penetrating body, showcasing a comprehensive approach to enhancing chip packaging technologies.
Career Highlights: Tan is currently employed at Silergy Semiconductor Technology (Hangzhou) Ltd., where he continues to push the boundaries of semiconductor innovations. His expertise and creative solutions have established him as a leading figure in the semiconductor packaging arena.
Collaborations: Xiaochun Tan's innovative journey is further supported by his collaborations with talented colleagues such as Jiaming Ye and Wei P Chen. Together, they contribute to advancing technology and improving semiconductor packaging methodologies, fostering a dynamic work environment that encourages creativity and invention.
Conclusion: Xiaochun Tan's dedication to innovation is evident through his extensive patent portfolio and his work at Silergy Semiconductor Technology (Hangzhou) Ltd. He continues to be a driving force in the field, shaping the future of semiconductor packaging with impactful inventions that address the industry's evolving needs.