The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Jan. 16, 2015
Silergy Semiconductor Technology (Hangzhou) Ltd., Hangzhou, CN;
Xiaochun Tan, Hangzhou, CN;
Jiaming Ye, Hangzhou, CN;
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD., Hangzhou, CN;
Abstract
A package assembly and a method for manufacturing the same are disclosed. The package assembly includes a leadframe having at least two groups of leads and a plurality of electronic devices arranged in at least two levels. Each group of leads is electrically coupled to a respective level of electronic devices. The package assembly further includes an interconnect for coupling one or more leads of one group of leads to one or more leads of another group of leads. The package assembly results in increased packaging density, less usage of bonding wires in the package assembly, improves reliability, and prevents possible interference.