The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Mar. 04, 2019
Silergy Semiconductor Technology (Hangzhou) Ltd, Hangzhou, ZheJiang Province, CN;
Xiaochun Tan, Hangzhou, CN;
Silergy Semiconductor Technology (Hangzhou) LTD, Hangzhou, CN;
Abstract
A package structure can include: (i) a substrate having opposite first and second surfaces; (ii) a die having opposite active and back surfaces, where the die is arranged above the first surface of the substrate, the back surface of the die is adjacent to the first surface of the substrate; (iii) pads arranged on the active surface of the die; (iv) a first encapsulator configured to encapsulate the die; (v) an interconnection structure configured to electrically connect to the pads through the first encapsulator; (vi) a second encapsulator configured to encapsulate the interconnection structure; and (vii) a redistribution structure configured to electrically connect to the interconnection structure and to provide external electrical connectivity.