Average Co-Inventor Count = 3.2

ph-index = 10

Forward Citations = 440(Granted Patents)

Location History:

Naugatuck, CT (US) (1998)
Singapore, SG (2001)
Endicott, NY (US) (1990 - 2013)
Kaohsiung, TW (2019 - 2021)

Company Filing History:

14 out of 164,108

International Business Machines Corporation

patents

6 out of 1,867

Advanced Semiconductor Engineering, Inc.

patents

2 out of 1,473

Agency for Science, Technology and Research

patents

4. 1 out of 19

Institute of Materials Research and Engineering

6. 1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1990-2021

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24 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 10916429 - Semiconductor device packages and stacked package assemblies including high density interconnections (2021-02-09),

2. 10886263 - Stacked semiconductor package assemblies including double sided redistribution layers (2021-01-05),

3. 10535521 - Semiconductor device packages and stacked package assemblies including high density interconnections (2020-01-14),

4. 10515806 - Semiconductor device packages and stacked package assemblies including high density interconnections (2019-12-24),

5. 10276382 - Semiconductor device packages and stacked package assemblies including high density interconnections (2019-04-30),

6. 8399776 - Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package (2013-03-19),

7. 7227268 - Placement of sacrificial solder balls underneath the PBGA substrate (2007-06-05),

8. 7026012 - Method and apparatus for forming a metallic feature on a substrate (2006-04-11),

9. 6863936 - Method of forming selective electroless plating on polymer surfaces (2005-03-08),

10. 6829149 - Placement of sacrificial solder balls underneath the PBGA substrate (2004-12-07),

11. 6358627 - Rolling ball connector (2002-03-19),

12. 6353182 - Proper choice of the encapsulant volumetric CTE for different PGBA substrates (2002-03-05),

13. 6258627 - Underfill preform interposer for joining chip to substrate (2001-07-10),

14. 6255599 - Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination (2001-07-03),

15. 6214642 - Area array stud bump flip chip device and assembly process (2001-04-10),

Title: The Innovative Mind of William T Chen

Introduction:

William T Chen, a prolific inventor based in Endicott, NY, has made significant contributions to the field of semiconductor devices with a remarkable portfolio of 23 patents.

Latest Patents:

His recent patents showcase his expertise in semiconductor device packages and stacked package assemblies with high-density interconnections, demonstrating his focus on cutting-edge technologies in the industry.

Career Highlights:

Chen's professional journey has been marked by impactful roles at renowned companies such as IBM (International Business Machines Corporation) and Advanced Semiconductor Engineering, Inc. These experiences have undoubtedly shaped his innovative approach to problem-solving in the semiconductor sector.

Collaborations:

Throughout his career, Chen has collaborated with distinguished colleagues such as Chi Shih Chang and Ajit Kumar Trivedi, further enriching his knowledge and fostering a collaborative spirit within the industry.

Conclusion:

In conclusion, William T Chen's dedication to pushing the boundaries of semiconductor technology through his inventions and collaborations cements his legacy as a visionary inventor in the ever-evolving world of patents and innovations. His work continues to inspire and drive progress in the semiconductor industry for years to come.

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