The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Feb. 22, 2002
Applicants:
William T. Chen, Endicott, NY (US);
Peter M. Moran, Singapore, SG;
Inventors:
William T. Chen, Endicott, NY (US);
Peter M. Moran, Singapore, SG;
Assignee:
Agency for Science, Technology and Research, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/10 (2006.01); B05D 1/36 (2006.01); B05D 5/00 (2006.01); B05D 1/18 (2006.01); B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.