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For the Inventor, By the Inventor

Portland, OR, United States of America

William O Alger

USPTO Granted Patents = 13

Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 179(Granted Patents)


Company Filing History:

goldMedal13 out of 54,750 
 
Intel Corporation
 patents

Years Active: 2005-2012

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13 patents (USPTO):Explore Patents
1. 8307548 - Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method (2012-11-13),
2. 7843057 - Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method (2010-11-30),
3. 7630601 - Connecting a component with an embedded optical fiber (2009-12-08),
4. 7373068 - Connecting a component with an embedded optical fiber (2008-05-13),
5. 7361842 - Apparatus and method for an embedded air dielectric for a package and a printed circuit board (2008-04-22),
6. 7343576 - Conductor trace design to reduce common mode cross-talk and timing skew (2008-03-11),
7. 7234947 - Electrical socket with compressible domed contacts (2007-06-26),
8. 7121841 - Electrical socket with compressible domed contacts (2006-10-17),
9. 7043706 - Conductor trace design to reduce common mode cross-talk and timing skew (2006-05-09),
10. 7022919 - Printed circuit board trace routing method (2006-04-04),
11. 6992899 - Power delivery apparatus, systems, and methods (2006-01-31),
12. 6916183 - Array socket with a dedicated power/ground conductor bus (2005-07-12),
13. 6882762 - Waveguide in a printed circuit board and method of forming the same (2005-04-19),

Title: **William O. Alger: Innovator in Fiber Reinforced Technology**

Introduction

William O. Alger, based in Portland, OR, is a prominent inventor with a remarkable portfolio of 13 patents. His contributions have significantly advanced the field of printed circuit board technology, particularly in the realm of fiber reinforcement methods. William's innovative approach and dedication to research have positioned him as a valuable asset to the industry.

Latest Patents

William O. Alger's latest patents include revolutionary methods for creating fiber reinforced printed circuit board panels. One such patent describes a process for making a printed circuit board panel that incorporates fiber bundles positioned at specific angles to enhance the structural integrity and performance of the board. The design features a panel with a top edge, a bottom edge, and side edges, which collectively contribute to a robust system for printed circuit boards.

Career Highlights

William O. Alger has cultivated a successful career at Intel Corporation, where he has been instrumental in developing cutting-edge technologies. His focus on innovation in the production of printed circuit boards has set new standards within the industry. His patents not only reflect his technical expertise but also his ability to foresee future needs in technology.

Collaborations

Throughout his career, William has had the opportunity to collaborate with distinguished colleagues such as Gary Baxter Long and Gary A. Brist. These partnerships have fostered an environment of shared knowledge and innovation, enhancing the creative output of their projects.

Conclusion

William O. Alger's innovative spirit and dedication to advancing technology in fiber reinforced printed circuit boards underscore his importance as an inventor in the field. With his invaluable contributions at Intel Corporation, he continues to drive progress and inspire future generations of inventors.

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