Intel Corporation

William O Alger

Gary A Brist

Gary Baxter Long

Jayne L Mershon

Carlos Mejia

Bryce D Horine

Michael W Beckman

Dennis J Miller

A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.

Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method

The invention provides an optical connection between a component on a printed circuit board ('PCB') and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Connecting a component with an embedded optical fiber

The invention provides an optical connection between a component on a printed circuit board ('PUB') and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing the conductor, and a sealed air channel between and separating the conductor and the conductor layer from contacting each other. A gas in the sealed air channel provides a primary dielectric therein. The gas may be air.

Apparatus and method for an embedded air dielectric for a package and a printed circuit board

A method and apparatus for reducing timing skew between conductor traces. A dielectric medium made of a resin reinforced with a fabric is provided. The fabric includes a first plurality of yarns running parallel to a first axis and a second plurality of yarns running parallel to a second axis. The first plurality of yarns are separated by a first weave pitch and the second plurality of yarns separated by a second weave pitch. At least two conductor traces are formed on the dielectric medium. The conductor traces are positioned on the dielectric medium such that the conductor traces each have substantially similar effective dielectric constants.

Conductor trace design to reduce common mode cross-talk and timing skew

A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.

Electrical socket with compressible domed contacts

An I/O routing pattern method is disclosed, for use with heterogeneous printed circuit boards (PCBs), such as those embedded with a reinforcement material, for example, a fiberglass weave. Traces are routed on the PCB so as to reduce sensitivity to changes in the dielectric constant (D), which are brought about by the strands of reinforcement material contained within the PCB laminate. The method minimizes the local variations, such as the D, time of flight, and capacitance variations, that are observed with traditional routing methods on heterogeneous PCBs.

Printed circuit board trace routing method

An apparatus and system, as well as fabrication methods therefor, may include a conductor attached to a carrier to bridge a contact field defined by a circuit that can be mounted to a circuit board.

Power delivery apparatus, systems, and methods

An apparatus for receiving a microchip and having a conductor buses therein. A top surface of the apparatus receives the microchip while the bottom surface is to mount to a circuit board. A plurality of pin receptacles pass through the top surface to receive a corresponding plurality of microchip pins of the microchip. The conductor bus resides at least in part between the top surface and the bottom surface and is electrically coupled to a first plurality of the plurality of the pin receptacles.

Array socket with a dedicated power/ground conductor bus

A method is provided for forming a waveguide in a printed circuit board. This may include forming a trench in a printed circuit board substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.

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Portland, OR, United States of America

William O Alger