Company Filing History:

25 out of 12,867

Advanced Micro Devices Corporation

1 out of 832,680

Other

patents

Years Active: 1994-2005

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27 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 6856849 - Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters (2005-02-15),

2. 6850322 - Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace (2005-02-01),

3. 6819963 - Run-to-run control method for proportional-integral-derivative (PID) controller tuning for rapid thermal processing (RTP) (2004-11-16),

4. 6650957 - Method and apparatus for run-to-run control of deposition process (2003-11-18),

5. 6607926 - Method and apparatus for performing run-to-run control in a batch manufacturing environment (2003-08-19),

6. 6592429 - Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures (2003-07-15),

7. 6567718 - Method and apparatus for monitoring consumable performance (2003-05-20),

8. 6560503 - Method and apparatus for monitoring controller performance using statistical process control (2003-05-06),

9. 6556884 - Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework (2003-04-29),

10. 6546306 - Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimized (2003-04-08),

11. 6529789 - Method and apparatus for automatic routing for reentrant processes (2003-03-04),

12. 6484064 - Method and apparatus for running metrology standard wafer routes for cross-fab metrology calibration (2002-11-19),

13. 6454899 - Apparatus for filling trenches (2002-09-24),

14. 6376261 - Method for varying nitride strip makeup process based on field oxide loss and defect count (2002-04-23),

15. 6360133 - Method and apparatus for automatic routing for reentrant process (2002-03-19),

Title: William Jarrett Campbell: Innovator in Semiconductor Processing Technologies

Introduction: William Jarrett Campbell, based in Austin, TX, is a prominent inventor with an impressive portfolio of 26 patents that significantly contribute to the field of semiconductor processing. His work encompasses innovative methods and apparatuses designed to enhance the efficiency and effectiveness of wafer processing.

Latest Patents: Among his latest contributions, Campbell developed a "Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters." This method involves measuring at least one characteristic parameter during processing and utilizing a correlation model to modify the processing steps accordingly. Additionally, he holds a patent for a "Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace." This technology optimizes the baking process by measuring the film thickness of wafers in different furnace zones and adjusting the deposition rate and bake times to ensure uniformity across all wafers.

Career Highlights: Throughout his career, Campbell has made significant strides in semiconductor technology, particularly during his tenure at reputable companies such as Advanced Micro Devices Corporation and AMD Inc. His expertise in thermal processing and wafer control has made a lasting impact on the industry.

Collaborations: Campbell has collaborated with esteemed professionals such as Anthony John Toprac and Michael Lee Miller. These partnerships have fostered a productive exchange of ideas and innovations within the semiconductor sector.

Conclusion: William Jarrett Campbell's contributions to semiconductor processing through his extensive patent portfolio and collaborations highlight his role as a key innovator in the field. His methods and apparatuses not only reflect his expertise but also pave the way for advancements in technology that enhance the efficiency of wafer processing. The impact of his work is felt throughout the industry, driving continual improvement and innovation.

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