The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Jul. 28, 2000
William J. Campbell, Austin, TX (US);
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
A method for controlling wafer uniformity in a polishing tool includes providing a plurality of carrier heads, determining a signature for each of the carrier heads, and installing carrier heads with similar signatures in a polishing tool. A processing line includes a polishing tool and a processing tool. The polishing tool is adapted to polish wafers. The polishing tool includes a plurality of carrier heads, each carrier head having a polishing signature similar to the other carrier heads. The processing tool is adapted to process the polished wafers in accordance with a recipe. At least one parameter in the recipe is based on the polishing signatures of the carrier heads.