The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Dec. 29, 2000
William Jarrett Campbell, Austin, TX (US);
Scott Bushman, Richardson, TX (US);
Thomas Sonderman, Austin, TX (US);
Elfido Coss, Jr., Austin, TX (US);
William Jarrett Campbell, Austin, TX (US);
Scott Bushman, Richardson, TX (US);
Thomas Sonderman, Austin, TX (US);
Elfido Coss, Jr., Austin, TX (US);
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
A method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace is provided. The multi-zone furnace bakes a plurality of wafers within each zone for a first bake time. A film thickness of at least one wafer baked in each zone of the furnace is measured using a metrology tool. A film thickness optimization unit determines a deposition rate for the at least one wafer within each zone, with the deposition rate being determined as a function of the film thickness of the wafer and the first bake time. The film thickness optimization unit then determines a second bake time to bake a subsequent set of wafers, and the subsequent set of wafers is baked in the furnace for the second bake time.