Wen-Bo Ding

Title: Innovations by Wen-Bo Ding in Semiconductor Manufacturing

Introduction

Wen-Bo Ding is a notable inventor based in Singapore, SG, recognized for his contributions to semiconductor technology. He holds a total of 3 patents, showcasing his expertise and innovative approach in the field.

Latest Patents

Ding's latest patents include a manufacturing method of a semiconductor device. This method involves several steps, starting with providing a substrate that has a device structure and a first interconnection structure on its front side. A first annealing process is performed in a pure hydrogen atmosphere at a specified temperature. Following this, a second interconnection structure is formed on the back side of the substrate, and a second annealing process is conducted in a gas mixture that includes hydrogen at a different temperature. Another significant patent is a wafer level packaging method. This method includes bonding a first wafer over a second wafer, followed by a grinding process to remove the upper chamfered edge of the first wafer and reduce its thickness. A trimming process is then performed to remove the lower chamfered edge, resulting in a trimmed first wafer, which undergoes a second grinding process to further reduce its thickness.

Career Highlights

Wen-Bo Ding is currently employed at United Microelectronics Corporation, where he continues to advance semiconductor technologies. His work has significantly impacted the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Ding collaborates with esteemed colleagues, including Sheng Zhang and Chien-Kee Pang, who contribute to his innovative projects and research endeavors.

Conclusion

Wen-Bo Ding's contributions to semiconductor manufacturing through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence advancements in technology and manufacturing processes.