The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jun. 12, 2018
United Microelectronics Corp., Hsinchu, TW;
Li-Da Huang, Singapore, SG;
Wei-Hui Gao, Singapore, SG;
Chien-Kee Pang, Singapore, SG;
Wen-Bo Ding, Singapore, SG;
Sheng Zhang, Singapore, SG;
Wen-Shen Li, Singapore, SG;
Chee-Hau Ng, Singapore, SG;
Xiaoyuan Zhi, Singapore, SG;
UNITED MICROELECTRONICS CORP., Hsinchu, TW;
Abstract
A manufacturing method of a semiconductor device including the following steps is provided. A substrate having a device structure and a first interconnection structure on a front side is provided. A first annealing process is performed in an atmosphere of pure hydrogen at a first temperature. A second interconnection structure is formed on a back side of the substrate. A second annealing process is performed in an atmosphere of gas mixture including hydrogen at a second temperature.