Location History:
- Hua-Lien, TW (2000)
- Hsinchu, TW (2007)
Company Filing History:
Years Active: 2000-2007
Title: Innovations of Wei-Sheng Chia
Introduction
Wei-Sheng Chia is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of interconnects. With a total of 4 patents to his name, Chia's work has been instrumental in advancing manufacturing processes.
Latest Patents
Chia's latest patents include a method of forming interconnects with stacked alignment marks. This innovative method involves several steps, starting with the formation of a first film layer over a substrate. A portion of this layer is removed to create a first alignment mark pattern, followed by the formation of a first conductive layer that fills this pattern. Additionally, a second film layer is formed, and openings are created to establish a second alignment mark pattern. The process continues with the formation of conductive wires and a third film layer, culminating in the creation of via openings and a third conductive layer. Another notable patent is the stacked alignment mark, which comprises a first and second alignment mark located in different film layers, enhancing the precision of semiconductor manufacturing.
Career Highlights
Wei-Sheng Chia is currently employed at United Microelectronics Corporation, a leading semiconductor foundry. His work at this company has allowed him to collaborate on various innovative projects that push the boundaries of technology.
Collaborations
Chia has worked alongside talented colleagues, including Chih-Jung Chen and Chung-An Chen. Their combined expertise has contributed to the successful development of advanced semiconductor technologies.
Conclusion
Wei-Sheng Chia's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to shape the future of manufacturing processes in the industry.