Wei Ming Lim

Title: Innovations of Wei Ming Lim

Introduction

Wei Ming Lim is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of integrated circuits and memory interfaces. With a total of 2 patents to his name, Lim continues to push the boundaries of technology.

Latest Patents

One of his latest patents is titled "Test architecture for die to die interconnect for three dimensional integrated circuits." This invention involves a die-to-die repeater circuit that includes a transmit circuit coupled to a die-to-die interconnect. The transmit circuit features at least one flip flop functioning as part of a linear feedback shift register (LFSR) to transmit values across the interconnect for design for test (DFT) purposes. This ensures the proper operation of the die-to-die interconnect. Another significant patent is "Methods and apparatus for predictable protocol aware testing on memory interface." This invention describes an apparatus that supports protocol-aware testing on a memory interface. It includes a digital controller that receives multiple read request commands from a unit under test and manages the timing of input/output (I/O) commands based on the hold signal's transition.

Career Highlights

Wei Ming Lim is currently employed at Intel Corporation, where he applies his expertise in integrated circuit design and testing. His work has been instrumental in advancing the capabilities of memory interfaces and interconnect technologies.

Collaborations

Lim has collaborated with several talented individuals in his field, including Terrence Huat Hin Tan and Sreejit Chakravarty. These collaborations have fostered innovation and contributed to the success of their projects.

Conclusion

Wei Ming Lim's contributions to the field of technology through his patents and work at Intel Corporation highlight his role as a leading inventor. His innovative solutions continue to shape the future of integrated circuits and memory interfaces.