Wei-cheng Wu

Title: Innovations of Wei-cheng Wu

Introduction

Wei-cheng Wu is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on advanced packaging structures and semiconductor devices, showcasing his expertise and innovative spirit.

Latest Patents

Wei-cheng Wu's latest patents include a high bandwidth package structure and an electrical fuse (e-fuse) one-time programmable (OTP) device. The high bandwidth package structure involves a method that includes providing a first workpiece with a substrate and interconnect structure, bonding it to a second workpiece, and forming a protective film over the thinned substrate. The e-fuse device patent describes a semiconductor device that consists of a substrate, isolation structure, conductive structure, and contact structure, designed for enhanced performance and reliability.

Career Highlights

Wei-cheng Wu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to develop cutting-edge technologies that contribute to the advancement of electronic devices.

Collaborations

Throughout his career, Wei-cheng Wu has collaborated with notable colleagues, including Alexander Kalnitsky and Harry-Hak-Lay Chuang. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Wei-cheng Wu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in electronic devices and packaging solutions.