Vivek Gupta

Title: Innovations by Vivek Gupta in Semiconductor Device Packaging

Introduction

Vivek Gupta is a prominent inventor based in Phoenix, AZ, known for his significant contributions to the field of semiconductor device packaging. With a total of six patents to his name, Gupta has developed innovative methods that enhance the manufacturing processes of semiconductor devices.

Latest Patents

Gupta's latest patents focus on semiconductor device packaging warpage control. One of his methods involves placing a plurality of semiconductor die on a carrier substrate, which are then encapsulated with an encapsulant. A cooling fixture with multiple nozzles is utilized to cool the encapsulant, ensuring that the properties of air exiting the nozzles vary to optimize the cooling process. Another patent describes a method for manufacturing a semiconductor device packaging panel, which includes a warpage control carrier attached to the backside of the panel. This carrier features an electroactive element that flattens the panel when a control voltage is applied, demonstrating Gupta's innovative approach to addressing warpage issues in semiconductor packaging.

Career Highlights

Throughout his career, Vivek Gupta has worked with notable companies such as NXP USA, Inc. and Freescale Semiconductor, Inc. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Gupta has collaborated with several professionals in the industry, including Michael B. Vincent and Richard Te Gan. These collaborations have further enriched his work and contributed to the development of his patented technologies.

Conclusion

Vivek Gupta's innovative work in semiconductor device packaging has made a significant impact on the industry. His patents reflect a commitment to improving manufacturing processes and addressing challenges in semiconductor technology.