The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Jun. 28, 2013
Fred T. Brauchler, Canton, MI (US);
John M. Pigott, Phoenix, AZ (US);
Darrel R. Frear, Phoenix, AZ (US);
Vivek Gupta, Phoenix, AZ (US);
Randall C. Gray, Tempe, AZ (US);
Norman L. Owens, Sun Lakes, AZ (US);
Carl E. D'acosta, Mesa, AZ (US);
Fred T. Brauchler, Canton, MI (US);
John M. Pigott, Phoenix, AZ (US);
Darrel R. Frear, Phoenix, AZ (US);
Vivek Gupta, Phoenix, AZ (US);
Randall C. Gray, Tempe, AZ (US);
Norman L. Owens, Sun Lakes, AZ (US);
Carl E. D'Acosta, Mesa, AZ (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.