Hsinchu, Taiwan

Tzu-Jui Fang

This inventor holds 4 USPTO granted patents and 4 published patent applications and 1 EPO patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzu-Jui Fang. Retrieved from https://idiyas.com/inventor/tzu-jui-fang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.9

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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4 patents (USPTO):Explore Patents

Title: Tzu-Jui Fang: Innovator in Integrated Fan-Out Packaging

Introduction

Tzu-Jui Fang is a notable inventor based in Hsinchu, China. He has made significant contributions to the field of semiconductor packaging. His innovative work focuses on integrated fan-out packages, which are essential for modern electronic devices.

Latest Patents

Tzu-Jui Fang holds a patent for an integrated fan-out package, package-on-package structure, and manufacturing method thereof. This patent describes an integrated fan-out package that includes a first redistribution structure, a die, a plurality of conductive structures, an encapsulant, and a second redistribution structure. The die is bonded to the first redistribution structure through flip-chip bonding. The conductive structures surround the die, while the encapsulant encapsulates both the die and the conductive structures. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. Notably, the second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant. The top surfaces of the conductive structures that contact the second redistribution structure are coplanar with the top surface of the encapsulant.

Career Highlights

Tzu-Jui Fang is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work at this leading semiconductor manufacturer has allowed him to develop and refine his innovative packaging solutions. His contributions have been instrumental in advancing the technology used in electronic devices.

Collaborations

Some of Tzu-Jui Fang's coworkers include Shin-Puu Jeng and Hsien-Wen Liu. Their collaborative efforts in the field of semiconductor technology have further enhanced the development of innovative packaging solutions.

Conclusion

Tzu-Jui Fang is a prominent inventor whose work in integrated fan-out packaging has made a significant impact on the semiconductor industry. His innovative patent and contributions to Taiwan Semiconductor Manufacturing Company Ltd. highlight his role as a key player in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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