The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2019
Filed:
Nov. 01, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shin-Puu Jeng, Po-Shan Village, TW;
Hsien-Wen Liu, Hsinchu, TW;
Po-Yao Chuang, Hsinchu, TW;
Tzu-Jui Fang, Hsinchu, TW;
Yi-Jou Lin, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
Package structures and methods for forming the same are provided. A package structure includes a semiconductor die. The semiconductor die includes a passivation layer over a semiconductor substrate. The semiconductor die also includes a conductive pad in the passivation layer. The passivation layer partially exposes a top surface of the conductive pad. The package structure also includes an encapsulation layer surrounding the semiconductor die. The package structure further includes a dielectric layer covering the semiconductor die and the encapsulation layer. In addition, the package structure includes a redistribution layer covering the dielectric layer. The redistribution layer extends in the dielectric layer to be physically connected to the top surface of the conductive pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile