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Tzu-Chieh Shen

This inventor holds 11 USPTO granted patents and 10 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2016-2018.

USPTO Granted Patents = 11 (Patent Applications = 10)

% Patents Active = 100.0

Average Co-Inventor Count = 6.5

ph-index = 1

Forward Citations = 3(Granted Patents)

Company Filing History:

11 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2016-2018

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10141266 - Method of fabricating semiconductor package structure (2018-11-27),

2. 10068842 - Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same (2018-09-04),

3. 10043757 - Semiconductor package structure and method of fabricating the same (2018-08-07),

4. 10002825 - Method of fabricating package structure with an embedded electronic component (2018-06-19),

5. 9905438 - Method of manufacturing package substrate and semiconductor package (2018-02-27),

6. 9899249 - Fabrication method of coreless packaging substrate (2018-02-20),

7. 9735080 - Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same (2017-08-15),

8. 9716060 - Package structure with an embedded electronic component and method of fabricating the package structure (2017-07-25),

9. 9673140 - Package structure having a laminated release layer and method for fabricating the same (2017-06-06),

10. 9640503 - Package substrate, semiconductor package and method of manufacturing the same (2017-05-02),

11. 9510463 - Coreless packaging substrate and fabrication method thereof (2016-11-29),

Title: Tzu-Chieh Shen: Innovator in Semiconductor Packaging

Introduction

Tzu-Chieh Shen is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 11 patents. His innovative approaches have led to advancements in the efficiency and effectiveness of semiconductor structures.

Latest Patents

One of Tzu-Chieh Shen's latest patents is a method of fabricating a semiconductor package structure. This invention includes a package body with opposing surfaces, conductive pads, and an embedded semiconductor component, which reduces the overall thickness of the package. Another notable patent involves a single-layer wiring package substrate, which simplifies the fabrication process and reduces costs by creating a coreless package substrate.

Career Highlights

Tzu-Chieh Shen is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in enhancing the performance and reliability of semiconductor packages.

Collaborations

Some of Tzu-Chieh Shen's coworkers include Shih-Chao Chiu and Yu-Cheng Pai, who collaborate with him on various projects within the semiconductor industry.

Conclusion

Tzu-Chieh Shen's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the industry's needs and a drive to improve existing methods.

Profile summary based on public USPTO records.

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