The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Aug. 27, 2015
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Ming-Chen Sun, Taichung, TW;
Chun-Hsien Lin, Taichung, TW;
Tzu-Chieh Shen, Taichung, TW;
Shih-Chao Chiu, Taichung, TW;
Yu-Cheng Pai, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A package substrate and a semiconductor package are provided. The package substrate includes an insulating layer having opposing first and second surfaces; a first wiring layer formed in the insulating layer, exposed from the first surface of the insulating layer, and having a plurality of first conductive pads; a second wiring layer formed in the insulating layer, exposed from the second surface, and having a plurality of second conductive pads; a third wiring layer formed on the first surface and electrically connected with the first wiring layer; a plurality of first metal bumps formed on the first conductive pads corresponding; and at least one conductive via vertically embedded in the insulating layer and electrically connected to the second and third wiring layers. Therefore, the surfaces of first conductive pads are reduced, and the non-wetting between the first conductive pads and the solder materials formed on conductive bumps is avoided.