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Ming-Chen Sun

This inventor holds 13 USPTO granted patents and 10 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2016-2018.

USPTO Granted Patents = 13 (Patent Applications = 10)

% Patents Active = 100.0

Average Co-Inventor Count = 6.2

ph-index = 1

Forward Citations = 4(Granted Patents)

Company Filing History:

13 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2016-2018

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10141266 - Method of fabricating semiconductor package structure (2018-11-27),

2. 10096491 - Method of fabricating a packaging substrate including a carrier having two carrying portions (2018-10-09),

3. 10068842 - Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same (2018-09-04),

4. 10043757 - Semiconductor package structure and method of fabricating the same (2018-08-07),

5. 10002825 - Method of fabricating package structure with an embedded electronic component (2018-06-19),

6. 9905438 - Method of manufacturing package substrate and semiconductor package (2018-02-27),

7. 9899249 - Fabrication method of coreless packaging substrate (2018-02-20),

8. 9735080 - Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same (2017-08-15),

9. 9716060 - Package structure with an embedded electronic component and method of fabricating the package structure (2017-07-25),

10. 9673140 - Package structure having a laminated release layer and method for fabricating the same (2017-06-06),

11. 9640503 - Package substrate, semiconductor package and method of manufacturing the same (2017-05-02),

12. 9510463 - Coreless packaging substrate and fabrication method thereof (2016-11-29),

13. 9490225 - Package structure and fabrication method thereof (2016-11-08),

Title: Innovations by Inventor Ming-Chen Sun

Introduction

Ming-Chen Sun is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 13 patents. His work focuses on enhancing the efficiency and miniaturization of semiconductor components.

Latest Patents

Ming-Chen Sun's latest patents include a method of fabricating a semiconductor package structure. This innovative structure features a package body with opposing surfaces, conductive pads, and an embedded semiconductor component, which reduces the overall thickness of the package. Another notable patent involves a method of fabricating a packaging substrate that utilizes a carrier with two carrying portions. This method allows for the formation of circuit layers while maintaining the strength necessary for subsequent packaging processes. The carrying portions can be removed after packaging, further contributing to the miniaturization of the final product.

Career Highlights

Ming-Chen Sun is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading company has positioned him as a key player in the semiconductor industry. His innovative approaches have led to advancements that benefit both manufacturers and consumers.

Collaborations

Ming-Chen Sun has collaborated with notable coworkers, including Yu-Cheng Pai and Shih-Chao Chiu. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Ming-Chen Sun's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to pave the way for advancements in technology and miniaturization.

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