The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Feb. 12, 2015
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chia-Cheng Chen, Taichung, TW;
Ming-Chen Sun, Taichung, TW;
Tzu-Chieh Shen, Taichung, TW;
Shih-Chao Chiu, Taichung, TW;
Wei-Chung Hsiao, Taichung, TW;
Yu-Cheng Pai, Taichung, TW;
Don-Son Jiang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a laminate on the carrier, wherein the laminate has a built-up portion and a release portion smaller in size than the built-up portion, the release portion covering the bonding pads and the built-up portion being laminated on the release portion and the carrier; forming a plurality of conductive posts in the built-up portion; and removing the release portion and the built-up portion on the release portion such that a cavity is formed in the laminate to expose the bonding pads, the conductive posts being positioned around a periphery of the cavity. Therefore, the present invention has simplified processes.