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For the Inventor, By the Inventor

Taichung, Taiwan

Shih-Chao Chiu

USPTO Granted Patents = 13 

Average Co-Inventor Count = 5.9

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal13 out of 823 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2015-2018

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13 patents (USPTO):Explore Patents
1. 10141266 - Method of fabricating semiconductor package structure (2018-11-27),
2. 10068842 - Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same (2018-09-04),
3. 10043757 - Semiconductor package structure and method of fabricating the same (2018-08-07),
4. 10002825 - Method of fabricating package structure with an embedded electronic component (2018-06-19),
5. 9905438 - Method of manufacturing package substrate and semiconductor package (2018-02-27),
6. 9899249 - Fabrication method of coreless packaging substrate (2018-02-20),
7. 9735080 - Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same (2017-08-15),
8. 9716060 - Package structure with an embedded electronic component and method of fabricating the package structure (2017-07-25),
9. 9673140 - Package structure having a laminated release layer and method for fabricating the same (2017-06-06),
10. 9640503 - Package substrate, semiconductor package and method of manufacturing the same (2017-05-02),
11. 9510463 - Coreless packaging substrate and fabrication method thereof (2016-11-29),
12. 9490225 - Package structure and fabrication method thereof (2016-11-08),
13. 9082723 - Semiconductor package and fabrication method thereof (2015-07-14),

Title: Shih-Chao Chiu: Innovator in Semiconductor Packaging

Introduction

Shih-Chao Chiu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 13 patents. His innovative approaches have led to advancements in the efficiency and effectiveness of semiconductor structures.

Latest Patents

Chiu's latest patents include a method of fabricating a semiconductor package structure. This invention provides a semiconductor package structure that features a package body with opposing surfaces, conductive pads, and an embedded semiconductor component. The design reduces the overall thickness of the package, enhancing its practicality. Another notable patent is for a single-layer wiring package substrate, which simplifies the fabrication process and reduces costs. This method involves forming a wiring layer on a carrier and creating a dielectric body that exposes part of the wiring layer, resulting in a coreless package substrate.

Career Highlights

Chiu is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in developing new technologies that improve semiconductor packaging solutions. His innovative designs have garnered attention and recognition within the industry.

Collaborations

Chiu has collaborated with several talented individuals, including Yu-Cheng Pai and Ming-Chen Sun. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Shih-Chao Chiu's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.

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