The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Oct. 26, 2016
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Yu-Cheng Pai, Taichung, TW;
Chun-Hsien Lin, Taichung, TW;
Shih-Chao Chiu, Taichung, TW;
Wei-Chung Hsiao, Taichung, TW;
Ming-Chen Sun, Taichung, TW;
Tzu-Chieh Shen, Taichung, TW;
Chia-Cheng Chen, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and exposed from the first surface of the dielectric layer, wherein the first circuit layer has a plurality of first conductive pads; a plurality of protruding elements formed on the first conductive pads, respectively, wherein each of the protruding elements has contact surfaces to be encapsulated by an external conductive element; a second circuit layer formed on the second surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer for electrically connecting the first circuit layer and the second circuit layer. The present invention strengthens the bonding between the first conductive pads and the conductive elements due to a large contact area between the protruding elements and the conductive elements.