Company Filing History:

7 out of 52,722

Kabushiki Kaisha Toshiba

Years Active: 1992-1998

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5757066 - Resin-molded type semiconductor device and method of manufacturing the (1998-05-26),

2. 5733802 - Semiconductor device and method of manufacturing the same (1998-03-31),

3. 5684327 - Lead frame for use in a resin-sealed type semiconductor device (1997-11-04),

4. 5648682 - Resin-sealed semiconductor device and lead frame used in a resin-sealed (1997-07-15),

5. 5518937 - Semiconductor device having a region doped to a level exceeding the (1996-05-21),

6. 5401688 - Semiconductor device of multichip module-type (1995-03-28),

7. 5270224 - Method of manufacturing a semiconductor device having a region doped to (1993-12-14),

8. 5248895 - Semiconductor apparatus having resin encapsulated tab tape connections (1993-09-28),

9. 5191403 - Resin-sealed semiconductor device having a particular mold resin (1993-03-02),

10. 5111266 - Semiconductor device having a region doped to a level exceeding the (1992-05-05),

Title: Tsutomu Nakazawa: Innovator in Semiconductor Technology

Introduction

Tsutomu Nakazawa is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative work has paved the way for advancements in semiconductor devices and manufacturing methods.

Latest Patents

Among his latest patents is a resin-molded type semiconductor device and method of manufacturing it. This invention features a resin-sealed semiconductor device where support pins uphold a pair of facing sides of the semiconductor chip. A projected portion is formed on the distal end of the support pin, which is positioned near the semiconductor chip. The design ensures that when viewed from either side of the semiconductor chip, the projected portions overlap, maintaining uniform height. Additionally, the thickness of the resin on both sides of the semiconductor chip is equal, preventing any displacement within the sealing resin. Another notable patent involves a semiconductor device that boasts a very thin and highly reliable package, along with a method for its easy manufacturing. This method includes steps such as coating and melting a thermosetting resin in a divided mold, fixing a lead frame supporting a semiconductor chip, and applying pressure to compression-mold the resin.

Career Highlights

Throughout his career, Tsutomu Nakazawa has worked with notable companies such as Toshiba Corporation and Fujitsu Corporation. His experience in these leading technology firms has greatly influenced his innovative capabilities and contributions to the semiconductor industry.

Collaborations

He has collaborated with talented individuals in the field, including Yumi Inoue and Yuji Furumura. Their joint efforts have further enhanced the development of advanced semiconductor technologies.

Conclusion

Tsutomu Nakazawa's work in semiconductor technology exemplifies innovation and dedication. His patents and career achievements reflect his significant impact on the industry, making him a noteworthy figure in the realm of inventions.

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