The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1998
Filed:
Mar. 25, 1996
Yumi Inoue, Yokohama, JP;
Tsutomu Nakazawa, Koriyama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A resin sealed semiconductor device, wherein support pins uphold a pair of facing sides of the semiconductor chip. A projected portion is formed on the distal end portion of the support pin in proximate to the semiconductor chip. The projected portion is formed on both sides of the supporting members which respectively correspond to an upper side and a bottom side of the semiconductor chip in such a manner that when the projected portions are viewed from the upper side or bottom side of the semiconductor chip, they overlap with each other. All of the height of the projected portions are the same. The thickness of the resins formed on both opposite sides of the semiconductor chip is the same with each other, thus preventing the upward or downward displacement within the sealing resin of the semiconductor chip in a thin package.