The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 1998
Filed:
Oct. 03, 1995
Applicant:
Inventors:
Yumi Inoue, Yokohama, JP;
Tsutomu Nakazawa, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438127 ; 438112 ; 438124 ; 438126 ;
Abstract
There is provided a semiconductor device having a very thin, highly reliable semiconductor package and a method of easily manufacturing the semiconductor apparatus. The method comprises a first step of coating and melting a thermosetting resin in a mold for resin sealing, while keeping the mold at a predetermined temperature, the mold being divided into an upper mold and a lower mold, a second step of fixing within the mold a lead frame supporting a semiconductor chip, and a third step of applying a pressure on the mold and compression-molding the resin, thus forming a package.