The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1993
Filed:
Feb. 03, 1992
Applicant:
Inventor:
Tsutomu Nakazawa, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257787 ;
Abstract
A resin-sealed semiconductor device and a method for making the same are disclosed. The resin-sealed semiconductor device has a semiconductor chip, with a mold resin structure completely encapsulating and sealing the chip. The mold resin structure has resin upper and lower thicknesses, respectively, above and below the chip. The resin upper thickness is differentiated from the resin lower thickness so that the warp ratio of the resulting mold resin structure is more than 0.0025.