The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 1997
Filed:
Sep. 13, 1995
Tsutomu Nakazawa, Yokohama, JP;
Yumi Inoue, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A lead frame for use in a resin-sealed type semiconductor device, comprising an outer frame, a plurality of leads supported by the outer frame, arranged side by side and each composed of an inner lead and an outer lead, a die pad arranged inside the outer frame and located so that the tips of the inner leads are close to the die pad and oppose the die pad, and a resin flow-control body. The resin flow-control body has been formed by extending a portion of the outer frame toward the die pad through a space formed in the outer frame. The body is designed to be placed in a cavity of a mold having a gate communicating with the cavity, with the space located between the gate and the cavity, in order to form a resin sealing body.