Introduction: Tsung-Yen Lee, an accomplished inventor based in Jhudong, Taiwan, holds an impressive portfolio of 22 patents that significantly contribute to the field of semiconductor packaging. His inventions are pivotal in enhancing the efficiency and reliability of electronic devices in today's technology-driven world.

Latest Patents: Among his most recent patents, Tsung-Yen Lee has developed a novel package structure that includes an organic interposer substrate, a semiconductor die, conductive bumps, an underfill, and an insulating encapsulation. This innovative design features stacked organic dielectric layers and conductive wirings encapsulated within these layers. The semiconductor die, which possesses chamfered edges, is positioned over the organic interposer substrate, maintaining electrical connectivity through conductive bumps. The carefully designed underfill not only encapsulates the conductive bumps but also ensures contact with the chamfered edges of the semiconductor die, providing improved mechanical support. Moreover, he has also pioneered a unique package structure method characterized by a wall structure with partitions arranged in a discontinuous ring, allowing for enhanced performance and integration of semiconductor dies.

Career Highlights: Tsung-Yen Lee's career is marked by his role at Taiwan Semiconductor Manufacturing Company Ltd., where he has made significant strides in the semiconductor industry. His dedication to research and development has led to numerous advancements in packaging technologies, influencing how semiconductor components are integrated into various applications.

Collaborations: Working alongside talented coworkers such as Tzung-Chi Fu and Po-Chung Cheng, Tsung-Yen Lee has fostered a collaborative environment that encourages innovation and creative problem-solving in semiconductor technology. Their combined expertise contributes to the successful development of cutting-edge packaging solutions.

Conclusion: Tsung-Yen Lee's innovative contributions to semiconductor packaging demonstrate the importance of continued research and development in the electronics sector. His patents not only showcase his technical expertise but also pave the way for future advancements, reinforcing the critical role of inventors in shaping the technology landscape.

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