Tsung Lung Huang

Title: Tsung Lung Huang: Innovator in Semiconductor Manufacturing

Introduction

Tsung Lung Huang is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 4 patents. His innovative methods have advanced the technology used in semiconductor structures, showcasing his expertise and dedication to the industry.

Latest Patents

Huang's latest patents include a method of manufacturing a semiconductor structure. This method involves providing a first substrate with a plurality of conductive bumps, bonding it with a second substrate, and singulating a chip from the first substrate. Another notable patent describes a similar method, which includes an intermetal dielectric (IMD) layer and emphasizes the importance of patterned adhesive in the bonding process. These patents reflect his commitment to enhancing semiconductor technology.

Career Highlights

Tsung Lung Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to apply his innovative ideas and contribute to cutting-edge advancements in semiconductor manufacturing.

Collaborations

Huang has collaborated with notable colleagues, including Alexander Kalnitsky and Yi-Yang Lei. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the semiconductor field.

Conclusion

Tsung Lung Huang's contributions to semiconductor manufacturing through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced semiconductor technologies.