The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Oct. 23, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Alexander Kalnitsky, San Francisco, CA (US);
Yi-Yang Lei, Taichung, TW;
Hsi-Ching Wang, Taoyuan, TW;
Cheng-Yu Kuo, Kaohsiung, TW;
Tsung Lung Huang, Tainan, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chung-Shi Liu, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chin-Yu Ku, Hsinchu, TW;
De-Dui Liao, Hsin-Chu, TW;
Kuo-Chio Liu, Hsinchu, TW;
Kai-Di Wu, Tainan, TW;
Kuo-Pin Chang, Tainan, TW;
Sheng-Pin Yang, Kaohsiung, TW;
Isaac Huang, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method of manufacturing a semiconductor structure, including receiving a first substrate including a plurality of conductive bumps disposed over the first substrate; receiving a second substrate; disposing an adhesive over the first substrate; removing a portion of the adhesive to expose at least one of the plurality of conductive bumps; and bonding the first substrate with the second substrate.