This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017-2021
Title: Hsi-Ching Wang: Innovator in Semiconductor Manufacturing
Introduction
Hsi-Ching Wang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 4 patents. His innovative methods have advanced the technology used in semiconductor structures.
Latest Patents
Hsi-Ching Wang's latest patents include a method of manufacturing a semiconductor structure. This method involves providing a first substrate with a plurality of conductive bumps, bonding it with a second substrate, and singulating a chip from the first substrate. Another patent focuses on a similar method, which includes an intermetal dielectric (IMD) layer and emphasizes the importance of patterned adhesive in the bonding process.
Career Highlights
Hsi-Ching Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited. His work has been pivotal in enhancing semiconductor manufacturing processes, showcasing his expertise and innovative thinking in the industry.
Collaborations
Hsi-Ching Wang has collaborated with talented individuals such as Alexander Kalnitsky and Yi-Yang Lei. Their combined efforts have contributed to the advancement of semiconductor technologies.
Conclusion
Hsi-Ching Wang's contributions to semiconductor manufacturing highlight his role as an influential inventor in the field. His innovative methods and collaborations continue to shape the future of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile