Location History:
- Kanagawa, JP (2014 - 2019)
- Hiratsuka, JP (2010 - 2023)
- Isehara, JP (2024)
Company Filing History:
15 out of 370 
2 out of 33,490 
1 out of 5 Years Active: 2010-2024
Title: Innovations of Toshinori Ogashiwa
Introduction
Toshinori Ogashiwa is a prominent inventor based in Hiratsuka, Japan. He has made significant contributions to the field of conductive materials, holding a total of 16 patents. His work focuses on developing advanced bonding materials that enhance the performance and reliability of electronic components.
Latest Patents
Among his latest patents is a conductive bonding material that includes a molded article of a metal powder. This innovative bonding method utilizes a conductive bonding material containing metal powders such as gold, silver, platinum, and palladium, all with a purity of 99.9% or more. The average particle size of the metal powder ranges from 0.005 μm to 1.0 μm. The conductive bonding material exhibits a compressive deformation rate of 5% to 30% when subjected to a compression pressure of 5 MPa. Another notable patent involves a gold powder characterized by its high purity and optimized chloride and cyanide ion content, making it suitable for various bonding applications, including semiconductor chip die bonding and electrode formation.
Career Highlights
Toshinori Ogashiwa has worked with notable companies such as Tanaka Kikinzoku Kogyo Co., Ltd. and Seiko Epson Corporation. His experience in these organizations has allowed him to refine his expertise in the development of conductive materials and bonding technologies.
Collaborations
He has collaborated with talented individuals in the field, including Masayuki Miyairi and Yuya Sasaki. Their combined efforts have contributed to the advancement of innovative solutions in conductive bonding materials.
Conclusion
Toshinori Ogashiwa's contributions to the field of conductive materials and bonding technologies have established him as a key figure in innovation. His patents reflect a commitment to enhancing the performance of electronic components through advanced materials.