The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Nov. 18, 2011
Toshinori Ogashiwa, Kanagawa, JP;
Masaaki Kurita, Kanagawa, JP;
Takashi Nishimori, Kanagawa, JP;
Yukio Kanehira, Kanagawa, JP;
Toshinori Ogashiwa, Kanagawa, JP;
Masaaki Kurita, Kanagawa, JP;
Takashi Nishimori, Kanagawa, JP;
Yukio Kanehira, Kanagawa, JP;
Tanaka Kikinzoku Kogyo K.K., Tokya, JP;
Abstract
The present invention provides a transfer substrate for transferring a metal wiring material to a transfer-receiving object, the transfer substrate comprising a substrate, at least one metal wiring material formed on the substrate and an underlying metal film formed between the substrate and the metal wiring material, wherein the metal wiring material is a molded article prepared by sintering, e.g., gold powder having a purity of 99.9% by weight or more and an average particle size of 0.01 μm to 1.0 μm and the underlying metal film is composed of a metal such as gold or an alloy. The transfer substrate is capable of transferring a metal wiring material to the transfer-receiving object even at a temperature for heating the transfer-receiving object of 80 to 300° C.