The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Nov. 08, 2012
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Toshinori Ogashiwa, Kanagawa, JP;

Masaaki Kurita, Kanagawa, JP;

Takashi Nishimori, Kanagawa, JP;

Yukio Kanehira, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 21/71 (2006.01); B23K 35/30 (2006.01); B22F 7/08 (2006.01); B23K 35/32 (2006.01); B23K 35/02 (2006.01); B23K 35/00 (2006.01); B32B 15/01 (2006.01); C25D 7/00 (2006.01); C22C 5/02 (2006.01); C22C 5/04 (2006.01); C23C 18/16 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4814 (2013.01); B22F 7/08 (2013.01); B23K 35/007 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/322 (2013.01); B32B 15/018 (2013.01); C22C 5/02 (2013.01); C22C 5/04 (2013.01); C23C 18/165 (2013.01); C25D 7/00 (2013.01); H01L 21/71 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); B23K 2035/008 (2013.01); B23K 2101/40 (2018.08); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 2224/031 (2013.01); H01L 2224/03003 (2013.01); H01L 2224/0312 (2013.01); H01L 2224/03334 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/0567 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/05671 (2013.01); H01L 2224/05673 (2013.01); H01L 2224/05676 (2013.01); H01L 2224/05678 (2013.01); H01L 2224/05681 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/111 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11505 (2013.01); H01L 2224/1317 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/13173 (2013.01); H01L 2224/13176 (2013.01); H01L 2224/13178 (2013.01); H01L 2224/13181 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/94 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01044 (2013.01); H01L 2924/01045 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); Y10T 428/12056 (2015.01);
Abstract

A transfer substrate for transferring a metal wiring material to a transfer target including a substrate, at least one metal wiring material formed on the substrate, at least one coating layer formed on a surface of the metal wiring material, and an underlying metal film formed between the substrate and the metal wiring material, in which the metal wiring material is a compact formed by sintering metal powder such as gold powder having a purity of 99.9 wt % or more and an average particle size of 0.01 μm to 1.0 μm, and the coating layer is a predetermined metal such as gold or an alloy having a different composition from that of the metal wiring material and has a total thickness of 1 μm or less, and the metal underlying film is made of a predetermined metal such as gold or an alloy. The transfer substrate can lower heating temperature on the transfer target side.


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