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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9561952 B1

PDFFull Text
Date of Patent:
Feb. 07, 2017

Filed:

Dec. 22, 2014

Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member

Applicant:

Tanaka Kikinzoku Kogyo K.k., Chiyoda-ku, Tokyo, JP;

Inventors:

Toshinori Ogashiwa, Hiratsuka, JP;

Yuya Sasaki, Hiratsuka, JP;

Masayuki Miyairi, Hiratsuka, JP;

Assignee:

TANAKA KIKINZOKU KOGYO K.K., Tokyo, JP;

Attorney:

Orrick Herrington & Sutcliffe, LLP

Primary Examiner:

David Vu

Assistant Examiner:

Brandon Fox

Int. Cl.
CPC ...
H01L 23/28 (2006.01); B81B 7/00 (2006.01); H01L 51/52 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); B81C 1/00 (2006.01); H01L 21/50 (2006.01); H01B 1/02 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0045 (2013.01); B81C 1/00269 (2013.01); B81C 1/00325 (2013.01); H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 23/00 (2013.01); H01L 51/5243 (2013.01); H01L 51/5246 (2013.01); B81C 2203/019 (2013.01); H01B 1/02 (2013.01); H01L 23/10 (2013.01); H01L 24/94 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/167 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16598 (2013.01);
Abstract

The present invention is to provide an hermetic-sealing package member including a substrate and at least one frame-like sealing material for defining a sealing region formed on the substrate, in which the sealing material is formed of a sintered body obtained by sintering at least one metal powder selected from gold, silver, palladium, or platinum having a purity of 99.9 wt % or greater and an average particle size of 0.005 μm to 1.0 μm, and with respect to an arbitrary cross-section toward an outside from the sealing region, a length of an upper end of the sealing material is shorter than a length of a lower end. Examples of a cross-sectional shape of the sealing material may include one formed to have a base portion having a certain height and at least one mountain portion protruding from the base portion or one formed to have a mountain portion having substantially a triangular shape in which the length of the lower end of the sealing material is a bottom. By use of the hermetic-sealing package member of the present invention, a load is reduced at the time of hermetic-sealing and a sufficient sealing effect can be obtained.

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