Dresden, Germany

Torsten Mueller


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2008-2011

where 'Filed Patents' based on already Granted Patents

4 patents (USPTO):

Title: The Innovative Contributions of Torsten Mueller

Introduction

Torsten Mueller is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced methods for manufacturing integrated circuits and storage cells.

Latest Patents

One of his latest patents is titled "Storage cell having a T-shaped gate electrode and method for manufacturing the same." This patent describes a method for creating an integrated circuit that includes a substrate with parallel trenches and a dividing wall. The process involves filling these trenches with an insulating compound and layering conductive materials to form a T-shaped gate electrode. Another significant patent is for a "Semiconductor memory device and method of production." This invention details a method for producing bit lines through dopant implantation, utilizing a sacrificial hard mask layer, and ensuring self-alignment with buried bit lines.

Career Highlights

Throughout his career, Torsten Mueller has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Qimonda AG. His experience in these organizations has allowed him to develop and refine his innovative techniques in semiconductor manufacturing.

Collaborations

Torsten has collaborated with talented individuals such as Dominik Olligs and Nicolas Nagel. Their combined expertise has contributed to the advancement of technology in their field.

Conclusion

Torsten Mueller's contributions to semiconductor technology and his innovative patents highlight his role as a significant inventor in the industry. His work continues to influence the development of advanced integrated circuits and memory devices.

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