The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Jun. 30, 2005
Thomas Mikolajick, Dresden, DE;
Torsten Mueller, Dresden, DE;
Nicolas Nagel, Dresden, DE;
Lars Bach, Ullersdorf, DE;
Dominik Olligs, Dresden, DE;
Veronika Polei, Dresden, DE;
Thomas Mikolajick, Dresden, DE;
Torsten Mueller, Dresden, DE;
Nicolas Nagel, Dresden, DE;
Lars Bach, Ullersdorf, DE;
Dominik Olligs, Dresden, DE;
Veronika Polei, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor product includes, a substrate with a first dielectric layer having contact hole fillings for contacting active areas in the substrate. A second dielectric layer with contact holes is provided therein. The contact holes have a width in a first lateral direction. The product further includes conductive lines, each conductive line passing over contact holes in the second dielectric layer and contacting a plurality of contact hole fillings in the first dielectric layer. The conductive lines have a width, in the first lateral direction, that is smaller than the width of the contact holes of the second dielectric layer. The conductive lines are in direct mechanical contact with the contact hole fillings and thereby remove the need to provide any conventional 'contact to interconnect' structures.