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For the Inventor, By the Inventor

Dresden, Germany

Torsten Huisinga

USPTO Granted Patents = 19 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 34(Granted Patents)


Company Filing History:

goldMedal19 out of 5,671 
 
Globalfoundries Inc.
 patents

Years Active: 2011-2017

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):
1. 9685497 - Embedded metal-insulator-metal capacitor (2017-06-20),
2. 9478602 - Method of forming an embedded metal-insulator-metal (MIM) capacitor (2016-10-25),
3. 9305878 - Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects (2016-04-05),
4. 9287109 - Methods of forming a protection layer to protect a metal hard mask layer during lithography reworking processes (2016-03-15),
5. 9257329 - Methods for fabricating integrated circuits including densifying interlevel dielectric layers (2016-02-09),
6. 8932911 - Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects (2015-01-13),
7. 8922023 - Semiconductor device comprising metallization layers of reduced interlayer capacitance by reducing the amount of etch stop materials (2014-12-30),
8. 8859418 - Methods of forming conductive structures using a dual metal hard mask technique (2014-10-14),
9. 8786088 - Semiconductor device including ultra low-K (ULK) metallization stacks with reduced chip-package interaction (2014-07-22),
10. 8673770 - Methods of forming conductive structures in dielectric layers on an integrated circuit device (2014-03-18),
11. 8598714 - Semiconductor device comprising through hole vias having a stress relaxation mechanism (2013-12-03),
12. 8536050 - Selective shrinkage of contact elements in a semiconductor device (2013-09-17),
13. 8492269 - Hybrid contact structure with low aspect ratio contacts in a semiconductor device (2013-07-23),
14. 8435841 - Enhancement of ultraviolet curing of tensile stress liner using reflective materials (2013-05-07),
15. 8399335 - Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal features (2013-03-19),

Title: Torsten Huisinga: Innovator in Semiconductor Technology

Introduction

Based in Dresden, Germany, Torsten Huisinga is a dedicated inventor with a remarkable portfolio of 19 patents, focusing primarily on advancements in semiconductor technology. His inventive contributions have significantly impacted the field, particularly in the development of capacitor structures crucial for modern electronic devices.

Latest Patents

Huisinga's most recent innovations include an embedded metal-insulator-metal (MIM) capacitor, a sophisticated semiconductor device that features a unique arrangement of dielectric and conductive layers. This invention comprises a first metallization layer with a first dielectric layer, and an innovative structure that allows for enhanced performance of capacitors in electrical applications. Additionally, he has developed a method for manufacturing this MIM capacitor, detailing the sequential formation of layers essential for creating an efficient capacitor structure.

Career Highlights

Torsten Huisinga has established himself as a key figure in the semiconductor industry through his role at GlobalFoundries Inc., where he plays a significant part in driving innovation and product development. His technical expertise and forward-thinking approach have enabled him to contribute to crucial projects that enhance semiconductor manufacturing processes and device functionality.

Collaborations

Throughout his career, Huisinga has collaborated with notable colleagues, including Ralf Richter and Jens Heinrich. These partnerships have allowed him to expand his knowledge and contribute to multi-faceted projects that require a blend of inventive insights and technical prowess.

Conclusion

Torsten Huisinga's contributions to semiconductor technology underscore his status as a prominent inventor. With numerous patents to his name, his work continues to shape the future of electronic devices. His ongoing efforts at GlobalFoundries Inc. promise to lead to more groundbreaking innovations in the years to come.

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